Thermal/Mechanical Architect (Full Time-USC or Green Card Holder)

Thermal/Mechanical Architect (Full Time-USC or Green Card Holder)

Location: Santa Clara, California, United States (Hybrid)

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Job description

As the Thermal Lead, you will:

Architect next-generation thermal and mechanical solutions for data center servers at the component, board, and chassis levels, including aggressive air cooling, single/two-phase liquid cooling, and potential immersion cooling.

Define and own the thermal specifications for Rivos silicon and cooling components, ensuring seamless integration for customers.

Collaborate with external suppliers to source and evaluate thermal components such as heatsinks, fans, thermal interface materials (TIM), cold plates, and novel chip coolers.

Develop complex thermal models using CFD and FEA techniques to inform silicon and system-level design decisions.

Lead a team of thermal, mechanical, and hardware engineers, providing mentorship, feedback, and strategic direction for thermal and mechanical innovations.

Track industry trends, OCP guidelines, and emerging technologies to shape Rivos' roadmap for thermal, mechanical, and hardware engineering

Maintain Bill of Materials (BOMs) for thermal and mechanical components across multiple projects.

Coordinate with manufacturing partners (CM, OEMs, and ODMs) to develop prototypes, test samples, and production parts.

Work closely with Technical Program Managers (TPMs) to manage schedules, volumes, lead times, and budgets effectively.

Qualifications

15+ years of experience in cooling system design and electronics packaging for data centers, including liquid cooling.

Proven technical and team leadership experience in engineering design and development teams.

Industry leadership in thermal design, with a track record of technical publications and/or patents.

Expert in numerical and computational methods for thermal analysis, with strong proficiency in:

Ansys Suite (IcePak, Mechanical) for CFD and FEA simulations.

MCAD/PLM tools such as Creo/Windchill, SolidWorks, or NX/Teamcenter.

Strong strategic thinking and ability to operate at both component and system levels.

Experienced in working with contract manufacturers (CMs), OEMs, and ODMs.

Passion for emerging technologies, with a drive to explore and implement innovative cooling techniques.

Excellent communication and interpersonal skills, with a team-oriented mindset.

Ability to thrive in a fast-paced startup environment and adapt to evolving challenges.

Preferred Qualifications

Familiarity with CPU socket design and assemblies.

Knowledge of OCP mechanical design guidelines, including Colo boxes and rack designs.

Understanding of semiconductor packaging.

Experience with fabrication processes, including sheet metal, injection molding, and soft/hard tooling.

Education

Ph.D. in Mechanical Engineering or equivalent practical experience, with an emphasis on conjugate heat transfer.