Description

RESPONSIBILITIES

  • Develop competence in a product area and be recognized as a regional expert
  • Test the products extensively in internal and drive field testing.
  • Work independently and as a member of a team and motivate others
  • Be a mentor for junior levels
  • Provide neat, accurate, and thorough work in a timely manner
  • Complete assignments without specific directions, recognize problems, and apply or suggest viable solutions
  • Ability to understand high-speed, high-performance signal and power integrity related issues, and work with peers and other business groups. 

MINIMUM QUALIFICATIONS

  • BS/MS in Engineering, Electrical Engineering, Computer Science, or related field with 4-7 years’ experience
  • Strong knowledge of EDA industry with strong background in Signal Integrity, Power Integrity, Electromagnetics, Thermal, and Stress.
  • Have experience with SI/PI simulation analysis from chip level to system level using SIPI tools such as Redhawk-SC/Redhawk-SC Electrothermal/AEDT/SIwave/HFSS/XtractIM, package model extraction, S-parameters and RLGC model.
  • Familiar with Package/PCB Design and extraction, familiar with circuit design and spice format.
  • Familiar with VLSI design flows towards RTL design, simulation, synthesis, timing and power
  • Working knowledge of the Linux operating system
  • Solid Perl, TCL, Python programming skills
  • Ability to learn quickly, analyse and solve complex problems, and work closely with others
  • Ability to complete high-quality work on time

PREFERRED QUALIFICATIONS

  • Ability to translate product spec into testing plans
  • Ability to drive field testing for products and summarize the testing results.
  • Ability to overcome obstacles and drive projects to completion
  • Excellent communication and interpersonal skills
  • Ability to work collaboratively across teams and geographies, and to mentor junior engineers 
  • Demonstrated skills in the following areas are a plus:
    • Multi-physics background, e.g. electromagnetics, thermal, stress analysis
    • 3DIC physical design 


 

Key Skills
Education

Any Graduate

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